Single-mode polymer optical waveguides using laser-direct write technology
“Elmogi, A., Bosman, E., Missinne, J., & Van Steenberge, G. (2016). Comparison of epoxy- and siloxane-based single-mode optical waveguides defined by direct-write lithography. OPTICAL MATERIALS, 52, 26–31.”

Single-mode polymer optical waveguides using imprinting (for sensing)
“Missinne, Jeroen, Nuria Teigell Beneitez, Marie-Aline Mattelin, Alfredo Lamberti, Geert Luyckx, Wim Van Paepegem, and Geert Van Steenberge. 2018. Sensors 18 (8): 2717–1–2717–14.”

Compact Packaged Silicon Photonic Bragg Grating Sensor Based on a Ball Lens Interface.
Missinne, Jeroen, Viktor Geudens, Steven Van Put, Giannis Poulopoulos, Michal Szaj, Charalampos Zervos, Hercules Avramopoulos, and Geert Van Steenberge. 2023. “Compact Packaged Silicon Photonic Bragg Grating Sensor Based on a Ball Lens Interface.” OPTICS AND LASER TECHNOLOGY 157. doi:10.1016/j.optlastec.2022.108768.

Alignment-tolerant Interfacing of a Photonic Integrated Circuit Using Back Side Etched Silicon Microlenses.
“Missinne, J., Beneitez, N. T., Mangal, N., Zhang, J., Vasiliev, A., Van Campenhout, J., Snyder, B., Roelkens, G., and Van Steenberge, G., Alignment-tolerant interfacing of a photonic integrated circuit using back-side etched silicon microlenses, in Silicon Photonics XIV, 10923, International Society for Optics and Photonics (2019).”

Monolithic Integration of Microlenses on the Backside of a Silicon Photonics Chip for Expanded Beam Coupling
“Mangal, Nivesh, Bradley Snyder, Joris Van Campenhout, Geert Van Steenberge, and Jeroen Missinne. 2021. “Monolithic Integration of Microlenses on the Backside of a Silicon Photonics Chip for Expanded Beam Coupling.” OPTICS EXPRESS 29 (5): 7601–7615. doi:10.1364/oe.412353.”

Expanded-Beam Backside Coupling Interface for Alignment-Tolerant Packaging of Silicon Photonics
“Mangal, Nivesh, Bradley Snyder, Joris Van Campenhout, Geert Van Steenberge, and Jeroen Missinne. 2020. “Expanded-Beam Backside Coupling Interface for Alignment-Tolerant Packaging of Silicon Photonics.” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 26 (2). doi:10.1109/jstqe.2019.2934161.”

Back-side emitted grating couplers for use with monolithically integrated microlenses
Mangal N, Missinne J, Van Steenberge G, Van Campenhout J, Snyder B. Performance evaluation of backside emitting O-Band grating couplers for 100 μm-thick silicon photonics interposers. IEEE PHOTONICS JOURNAL . Institute of Electrical and Electronics Engineers (IEEE); 2019;11(3):1–1.

Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer.
“Kaur K, Missinne J, Van Steenberge G. APPLIED PHYSICS LETTERS. 2014;104(6).”

Flip-chip assembly of VCSELs to silicon grating couplers via laser fabricated SU8 prisms.
“Kaur K, Subramanian A, Cardile P, Verplancke R, Van Kerrebrouck J, Spiga S, et al. OPTICS EXPRESS. 2015;23(22):28264–70.”

Aerosol-Jet printed interconnects for 60-Gb/s CMOS driver and microring modulator transmitter assembly.
“Elmogi, A., Ramon, H., Lambrecht, J., Ossieur, P., Torfs, G., Missinne, J., De Heyn, P., et al. (2018).  IEEE Photonics Technology Letters, 30(22), 1944–1947.”

Aerosol-jet printed interconnects for 2.5 D electronic and photonic integration.
“Elmogi, A., Soenen, W., Ramon, H., Yin, X., Missinne, J., Spiga, S., Amann, M.-C., et al. (2018). JOURNAL OF LIGHTWAVE TECHNOLOGY, 36(16), 3528–3533.”